Miniaturized High-Density Hall-Effect Low Voltage Current Transformer (LVCT) Solution Soluciya na Miniaturized High-Density Hall-Effect Low Voltage Current Transformer (LVCT)
I. Tashanen da Turanci & Matukar
Matakanu aikin da ake amfani da su na farkon lokaci (CTs) suna da yawan kadan, yanayi a yi sharhi na AC kawai, da kuma ruskuka tsaya. A tuntubi masu aiki da aikin hanyar zamani (kamar tushen batiri, sabbin sarrafa, da kuma inbaita mai kudin kasa) don inganta aikin, kyakkyawar gwamnati, sharhi na DC, da kuma jawa da wani karfi, wannan aiki ya ba da aiki na aikin mai kudin kasa, mai girman gaba, da kuma Hall-effect current sensing approach na AC/DC.
II. Kungiyar Fanni: Closed-Loop Flux-Balance Hall Sensor + ASIC Integration
- Matakanu mai Kudin Kasa & Sensing Core
- Architectural Closed-Loop Flux-Balance: Micro silicon-based Hall chip fitowa a cikin flux-concentrating core (material da girman gaba).
- Sabbin Siffar da Tsaya:
- Magnetic field da take bayarwa a kan primary current an samu shi a kan Hall chip.
- High-gain feedback circuit ta sauri secondary coil don bayarwa counteracting field, da kuma ci gaba "zero-flux" state.
- Feedback current ta dace da primary current, da kuma ciye nonlinearity da temperature drift wanda ke faru a open-loop designs.
- Amfani da Signal Processing Mai Girman Gaba
- Dedicated ASIC Integration:
- Low-noise amplification of Hall signals
- Dynamic offset cancellation circuitry
- High-precision temperature compensation algorithm (mitigating silicon thermal drift)
- Adjustable low-pass filtering (typical: 100–250 kHz)
- Integrated voltage reference and output driver
- Ultra-Compact Structural Design
- Miniaturized Core: Optimized magnetic circuit with apertures as small as Ø5mm (standard through-hole) or rectangular surface-mount openings.
- SMD/Through-Hole Packaging:
- Surface-mount packages (e.g., SMD-8) for direct PCB assembly, height ≤ 10mm.
- Through-hole design (leadless structure) allows direct conductor routing through core aperture, enabling galvanically isolated installation.
III. Masu Baki & Value Proposition
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Dimension |
Advantage |
Value Proposition |
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Physical |
- >70% size reduction |
High-density PCB compatibility |
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- Ultralight weight (<5g) |
Ideal for drones/handheld devices |
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- SMD/through-hole structures |
Simplified installation |
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Electrical |
- AC/DC current measurement (DC–100kHz) |
EV powertrain monitoring |
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- Galvanic isolation (>2.5kV) |
Solar inverter OCP/PV leakage detection |
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- Virtually immune to saturation |
High-accuracy battery SOC estimation |
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- Low thermal drift (<0.05%/°C) |
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System Cost |
- Microamp-level quiescent current |
Extended battery life in portable devices |
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- Zero external compensation components |
Reduced BOM & calibration costs |
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- Full SMT automation compatibility |
Scalable for million-unit production |
IV. Target Applications
- Battery Management (BMS): High-precision DC current detection (±1%) for EV/ESS charge-discharge cycles.
- Compact Inverters: Phase current control in IGBT modules (100A-range SMD solutions).
- Servo Drives: Multi-axis motor current sampling (parallel SMD CT arrays).
- Smart Meters: DC-component metering (tamper/theft prevention).
- Data Center PSUs: Rack-level current monitoring (high-density through-hole integration).
V. Scalability & Future Roadmap
- Multi-Range Coverage: Single package supports 20A–500A ranges (via core/coil ratio optimization).
- Digital Interface: Optional I²C/SPI output variants (ADC-integrated ASIC).
- High-Precision Tier: Closed-loop achieves 0.5% linearity (25°C), meeting Class 1 metering standards.
