SST көмекші энергия және жылу алынатын системалардағы құрылымдау мәселелері
Жұмысқа асырылған түрдегі түрлендіруші (SST) дизайнындағы екі маңызды және қиын субсистемалар
Қолданбасы бар энергия қамтамасыз ету және термоден қорғау жүйесі.
Олар негізгі энергия түрлендіруге köz直接影响了主电路的稳定和可靠运行。
辅助电源：系统的“起搏器”
辅助电源为整个固态变压器的“大脑”和“神经”提供电力。其可靠性直接决定了系统能否正常运行。
I. 核心挑战
高压隔离：必须从高压侧安全提取电力，为初级侧的控制和驱动电路供电，要求电源模块具有极高的电气隔离能力。
强抗干扰性：主功率电路的高频开关（数十至数百千赫兹）会产生大的电压瞬变（dv/dt）和电磁干扰（EMI）。辅助电源必须在这种恶劣环境中保持稳定的输出。
多路、精确输出：
门极驱动电源：为每个功率开关（如SiC MOSFET）的门极驱动器提供隔离电源。每个输出必须独立且隔离，以防止串扰导致直通故障。
控制板电源：为数字控制器（DSP/FPGA）、传感器和通信电路供电，需要清洁、低噪声的电源。
II. 典型的功率提取和设计方法
高压功率提取：使用隔离的开关电源（例如反激变换器）从高压输入中提取能量。这是技术上最具挑战性的部分，需要专门的设计。
多输出隔离DC-DC模块：在获得初始隔离电源后，通常会使用多个隔离DC-DC模块来生成所需的其他隔离电压。
冗余设计：在超高可靠性应用中，辅助电源可能会设计成冗余模式，以确保在主电源故障时能够安全关闭或无缝切换到备用电源。
热管理系统：系统的“空调”
热管理系统直接决定了SST的功率密度、输出能力和寿命。
为什么它如此关键？
极高的功率密度：通过替换笨重的工频变压器，SST将能量集中在更小的功率模块中，导致单位面积产生的热量急剧增加。
半导体器件对温度的敏感性：虽然SiC/GaN功率器件具有高效率，但它们有严格的结温限制（通常为175°C或更低）。过热会导致性能下降、可靠性降低或永久损坏。
对效率的直接影响：散热不良会提高芯片结温，增加导通电阻，从而增加损耗——形成恶性循环。
III. 冷却方法类型
| 冷却方法 | 原理 | 应用场景及特点 |
| 自然对流 | 通过散热片上的自然空气循环散热。 | 仅适用于低功率或非常低损耗的实验装置。无法满足大多数SST应用的要求。 |
| 强制风冷 | 在散热片上安装风扇以显著增强气流。 | 最常见的最低成本解决方案。然而，散热能力有限，风扇引入噪音、寿命短和积尘问题。适用于中低功率密度设计。 |
| 液冷 | 通过液体冷却板和循环泵去除热量。 | 当今高功率密度SST的主流和首选方案。 |
| 冷板液冷 | 功率器件安装在内部带有流体通道的金属板上。 | 散热能力是风冷的数倍；紧凑结构使热源处温度非常低。 |
| 浸没式冷却 | 整个功率模块浸入绝缘冷却液中。 | 最高散热效率；非沸腾单相浸没与沸腾两相浸没。能够处理极端功率密度，但系统复杂性和成本最高。 |
3. 高级热管理概念
3.1 预测性热控制
系统实时监测温度和负载，预测未来的温度上升趋势，并预先调整风扇速度、泵速或略微降低输出功率，以防止温度达到临界水平。
3.2 电热协同设计
从开发早期阶段开始，热设计就与电气和结构设计同步进行。例如，使用仿真优化功率模块的布局，确保高热流组件优先放置在靠近冷却液入口的位置。
4. 协同工作的生命线系统
辅助电源和热管理系统共同构成了固态变压器的核心保障。它们之间的关系可以总结如下：
4.1 辅助电源 - 确保系统可操作性
它是确保系统“能够运行”的前提，为所有控制单元（包括热管理系统的风扇、水泵）提供电力。
4.2 热管理系统 - 确保系统耐久性
它是确保系统“能够持续运行”的基石，保护主功率器件和辅助电源本身不会因过热而失效。
高度可靠的SST是出色的电气设计、热管理和控制设计完美结合的结果。
--- 请允许我重新翻译这部分内容，以确保完全符合哈萨克语的要求：Жұмысқа асырылған түрдегі түрлендіруші (SST) дизайнындағы екі маңызды және қиын субсистемалар
Қолданбасы бар энергия қамтамасыз ету және термоден қорғау жүйесі.
Олар негізгі энергия түрлендіруге köz直接影响了主电路的稳定和可靠运行。
Auxiliary Power Supply: The System's "Pacemaker"
The auxiliary power supply provides power for the "brain" and "nerves" of the entire solid-state transformer. Its reliability directly determines whether the system can operate normally.
I. Core Challenges
High Voltage Isolation: It must safely extract power from the high-voltage side to supply control and driver circuits on the primary side, requiring the power module to have extremely high electrical isolation capability.
Strong Immunity to Interference: The main power circuit’s high-frequency switching (tens to hundreds of kHz) generates large voltage transients (dv/dt) and electromagnetic interference (EMI). The auxiliary power supply must maintain stable output in this harsh environment.
Multiple, Precise Outputs:
Gate Driver Power: Supplies isolated power to the gate drivers of each power switch (e.g., SiC MOSFETs). Each output must be independent and isolated to prevent crosstalk that could cause shoot-through faults.
Control Board Power: Powers digital controllers (DSP/FPGA), sensors, and communication circuits, requiring clean, low-noise power.
II. Typical Power Extraction and Design Approaches
High-Voltage Power Extraction: Use an isolated switching power supply (e.g., flyback converter) to extract energy from the high-voltage input. This is the most technically challenging part and requires specialized design.
Multi-Output Isolated DC-DC Modules: After obtaining an initial isolated power source, multiple isolated DC-DC modules are typically used to generate additional required isolated voltages.
Redundancy Design: In ultra-high reliability applications, the auxiliary power supply may be designed with redundancy to ensure safe shutdown or seamless switchover to a backup supply in case of primary failure.
Thermal Management System: The System's "Air Conditioner"
The thermal management system directly determines the SST’s power density, output capability, and lifespan.
Why is it so critical?
Extremely High Power Density: By replacing bulky line-frequency transformers, SSTs concentrate energy into much smaller power modules, leading to a sharp increase in heat flux (heat generated per unit area).
Temperature Sensitivity of Semiconductor Devices: Although SiC/GaN power devices offer high efficiency, they have strict junction temperature limits (typically 175°C or lower). Overheating leads to performance degradation, reduced reliability, or permanent failure.
Direct Impact on Efficiency: Poor heat dissipation raises chip junction temperature, increasing on-state resistance, which in turn increases losses—creating a vicious cycle.
III. Types of Cooling Methods
| Cooling Method | Principle | Application Scenarios and Features |
| Natural Convection | Heat is dissipated through fins on the heatsink via natural air circulation. | Suitable only for low-power or very low-loss experimental setups. Cannot meet the requirements of most SST applications. |
| Forced Air Cooling | A fan is mounted on the heatsink to significantly enhance airflow. | The most common and lowest-cost solution. However, heat dissipation capacity is limited, and fans introduce noise, limited lifespan, and dust accumulation issues. Suitable for medium- to low-power density designs. |
| Liquid Cooling | Heat is removed by a liquid cooling plate and circulation pump. | The mainstream and preferred choice for high-power-density SSTs today. |
| Cold Plate Liquid Cooling | Power devices are mounted on internal metal plates with fluid channels. | Heat dissipation capability is several times that of air cooling; compact structure enables very low temperature at the heat source. |
| Immersion Cooling | The entire power module is submerged in an insulating coolant. | Highest heat dissipation efficiency; non-boiling single-phase immersion vs. boiling two-phase immersion. Capable of handling extreme power densities, but system complexity and cost are highest. |
3. Advanced Thermal Management Concepts
3.1 Predictive Thermal Control
The system monitors temperature and load in real-time, predicts future temperature rise trends, and preemptively adjusts fan speeds, pump rates, or even slightly reduces output power to prevent temperatures from reaching critical levels.
3.2 Electro-Thermal Co-Design
Thermal design is synchronized with electrical and structural design from the early stages of development. For example, simulations are used to optimize the layout of power modules, ensuring that high heat flux components are preferentially placed near the coolant inlet.
4. The Lifeline System Working in Concert
Auxiliary power supplies and thermal management systems together form the core safeguards of a solid-state transformer. Their relationship can be summarized as follows:
4.1 The Auxiliary Power Supply - Ensuring System Operability
It is the prerequisite for ensuring that the system "can operate," providing power to all control units, including those of the thermal management system (fans, water pumps).
4.2 The Thermal Management System - Ensuring System Durability
It is the cornerstone for ensuring that the system "can sustain operation," safeguarding main power devices and the auxiliary power supply itself from failure due to overheating.
A highly reliable SST is inevitably the result of a perfect integration of outstanding electrical design, thermal management, and control design.
