Misali da Dukkantaka da Tashin Lissafi na Ikwai Gaba da Tashin Lissafin Kwamfuta a Tsakiyar Ikwai Gaba

1 Misali da Ruhunsa na Karamin Aiki na ECT
1.1 Tsarin Aiki na ECT

Karamin aiki na ECT (Electronic Current Transformer) shi ne wani babban zafi don inganta aiki na tsohon karamin siffar muhimmanci, tana gargaɗa masu karami mai yawa zuwa masu karami mafi yawan sauƙi don ci gaba da kontrollo. Wannan ya fi dacewa da karamin aiki na musamman (da ke amfani da tsari na baya ta hanyar ɗaukan baya da ɗaya) ECTs sun amfani da cikakken bayyana (kamar Hall effect sensors) don tabbatar da ƙungiyoyi na baya. Waɗannan cikakken bayyana sun fito shiga na analog (da yake da shugaban da shi a kan karamin baya) don ci gaba da tsarin electronics (tattauna, tsara, ko digitization). Ana iya samun shiga na digital daga ECTs masu zamani don amfani da su a kan protection, metering, da kontrollo. ECTs suna fi dacewa da karamin aiki na electromagnetic a cikin inganci, sauti, da kuma lafiya, saboda haka suke da tsari mai yawa, mai kyau, da kuma taimakawa waɗannan cikakken bayyana/communication.

1.2 Ruhunsa na ECT a Cikin Tsohon Karamin Siffar

ECTs sun ba da ci gaba mai inganci ga karamin baya da ke bukata don ci gaba da kontrollo, da kuma tsohon karamin siffar (kamar in kawo abin da ya haɗa da overloads/short circuits). Suna ba da dalilai da ke inganta al'amuran mutanen da kuma al'amuran kayayyakin, da kuma kawo karfi. Don metering/billing, ingancinta ECT yana ba da tsari mai inganci a kan pricing na siffar a cikin kayayyaki masu karami mai yawa. Bayanai na inganci sun taimaka wajen taimakawa tsohon karamin siffar da kuma inganci.

1.3 Tsarin Ƙaramin Duka

Tsarin ƙaramin duka na ECT (babban kompomanti) sun hada da cikakken bayyana (kamar Hall effect), tsarin ci gaba da shiga, analog-to-digital converters (ADCs), da kuma interfaces na communication. Waɗannan kompomantun sun yi aiki don ci gaba da shiga da shi don tuntubi. ECTs masu zamani suna da self-diagnosis don ci gaba da performance/faults, da kuma taimakawa tsohon karamin siffar masu zamani.

2 Abubuwan Ƙaramin Duka na ECTs
2.1 Ƙaramin Duka na Open-Circuit

Wadanda suna faruwa saboda karamin duka da ke rasa, ƙaramin duka da ke fuskantar, ko insulation da ke ƙare, ƙaramin duka na open-circuit sun kawo karfi a tsohon karamin, wanda yake da shiga (kamar zero/low) measurements. Wannan yana ƙasance a yi aiki da protection/control da ba daidai, wanda yake da shiga a tsohon karamin siffar.

2.2 Ƙaramin Duka na Short-Circuit

Sun faruwa idan ana samun ƙaramin duka da ba a nan (kamar damage da insulation) wanda ke kawo karfi a tsohon karamin, wanda yake da shiga a tsohon karamin siffar, da kuma kawo karfi a tsohon kayayyakin, ko kuma ƙare da protection malfunctions.

2.3 Ƙaramin Duka na Ground

Sun faruwa saboda ƙaramin duka da ba daidai (kamar insulation failure). Suna ƙare ƙaramin duka, wanda yake da shiga a tsohon karamin, protection malfunctions, ko kuma electric shocks (mai ƙarfin da ake yi a maintenance).

2.4 Ƙaramin Duka na Overload

Sun faruwa idan karamin baya yana fi girma da take ƙare (kamar saboda system anomalies). Ƙaramin duka na overload sun kawo karfi a tsohon kayayyakin, insulation degradation, ko kuma burnout. Ana samun shi a tsohon karamin/temperature monitoring, wanda yake da shiga a tsohon karamin siffar.

2.5 Electrical Noise Interference

Daga sources na external/internal (kamar EMI, RFI), noise yana ƙare shiga, wanda yake da shiga a tsohon karamin, protection system misactions (kamar shutdowns da ba daidai).

2.6 Ƙaramin Duka na Temperature-Influenced

Temperature mai ƙarfi sun ƙare aiki: heat mai ƙarfi sun ƙare semiconductors/insulation (wanda yake da shiga a tsohon short-circuit risks); temperature mai yawa sun ƙare components. Wannan yana ƙare tsohon karamin, ko kuma protection failures.

2.7 Ƙaramin Duka na Corrosion/Aging

Gradual component degradation (wires, insulation) saboda environmental factors (kamar humidity, chemicals) sun ƙare electrical performance, wanda yake da shiga a tsohon short-circuit/ground fault risks.

3 Online Diagnosis Methods for ECT Secondary Circuit Faults
3.1 Signal Acquisition

Relies on sensors (e.g., Hall effect/current transformers) and ADCs. Hall effect sensors measure current non-invasively, ensuring safety/accuracy. ADCs convert analog signals to digital form for processing. High-speed ADCs capture subtle signal changes, enabling rapid fault detection.

3.2 Time-Domain Analysis

Involves waveform/statistical analysis. Waveform analysis checks for irregularities (e.g., asymmetry/spikes, indicating component failures). Statistical analysis (e.g., mean/standard deviation) identifies signal stability/distribution, flagging fault-induced fluctuations.

3.3 Model-Based Fault Detection

Threshold detection uses preset limits to trigger alarms for abnormal signals (based on historical data/expert knowledge). Model comparison (advanced) compares real-time data to a “healthy” system model, detecting deviations for precise fault diagnosis.

3.4 Knowledge-Based Fault Location

Fault Tree Analysis (FTA) maps fault logic to identify root causes via hierarchical sub - fault analysis. Expert systems (simulating human expertise) use rules (historical data/prior knowledge) for precise fault location, handling complex scenarios.

3.5 Thermal Imaging Monitoring

Infrared thermal imagers detect abnormal heat (e.g., from overloads/aging insulation) in ECTs. Non-invasive and real-time, they enable safe fault diagnosis without interrupting operations. Combined with other methods, they improve accuracy (addressing limitations like non-temperature-related faults).

Key Notes

ECTs offer advantages over traditional transformers but face secondary circuit faults (e.g., open/short circuits, noise). Online diagnosis (signal acquisition, time-domain analysis, model-based/knowledge-based methods, thermal imaging) ensures reliable operation, adapting to modern power system demands.