Tambayar Girmamar Yadda Aiki na GIS Disconnector Ya Haɗa Da Turuwa na Farko
Tasiri na Ikkarfin GIS Disconnector a Fittattun Karamin Turuwa da Manufaruka
1.Tasiri na Ikkarfin GIS Disconnector a Fittattun Karamin Turuwa
1.1 Tasiri na Overvoltage na Tsakiyar Waniya
A lokacin da ake kare/kare Gas-Insulated Switchgear (GIS) disconnectors, yana faruwa wanda ake sanya hanyar shiga da rarrabe a kan maganunan, wanda ke sa iya gina mafi karfi a kan inductance da capacitance na system, tana gina switching overvoltages masu ma'ana biyu zuwa nafarin dole a cikin rated phase voltage da tsawon nan ya kai daga faduwar microseconds zuwa milliseconds. Idan ake kare short busbars—indace da speed na contact na disconnector yana da kyau da ba a gina arc-quenching capability bane—yana faruwa pre-strike da re-strike phenomena wanda ke gina Very Fast Transient Overvoltages (VFTOs).
VFTOs ke gajeruwar da suka haɗa tun daga conductors da enclosures na GIS. A kan discontinuities na impedance (misali, bushings, instrument transformers, cable terminations), traveling waves ke gajeruwar, refract, da superimpose, yana yi abu da waveforms da zama da amfani da VFTO peaks. Da wavefronts mai tsayi da rise times na nanosecond-scale, VFTOs ke gina transient voltage surges a kan inputs na fittattun karamin turuwa, wanda ke iya gina lalacewa a kan electronics mai kyau. Wannan zai iya gina protective relays suka maloperate—wanda ke jin wannan tripping—da kuma yanhaɓar signal processing da data transmission mai kyau. Duk da haka, EMI na high-frequency da VFTO yake gina ita ce ke gina bit error rates ko kuma data loss, don haka yana ci nasara a kan monitoring da control functions na substation.
1.2 Potential Rise na Enclosure
Idan China ta fiye aiki a cikin ultra-high-voltage (UHV) da extra-high-voltage (EHV) grids, electromagnetic interference daga ikkarfin GIS disconnector yana zama da ma'ana. Tashar coaxial na GIS—wanda an samu aluminum/copper conductors da enclosures na aluminum/steel—yana da abubuwan high-frequency transmission mai kyau. Saboda skin effect, high-frequency transient currents ke haɗa a kan outer surface na conductor da inner surface na enclosure, indace da yake da field leakage da take sa enclosure a ground potential a lokutan da ake da shi.
Amma, idan VFTO-induced transient currents suka haɗa a kan impedance mismatches (misali, a bushings ko cable terminations), partial reflection da refraction ke faru. Yana da some voltage components da ke gina a kan enclosure da earth, wanda ke gina instantaneous potential rise a kan enclosure da ake da shi. Wannan yana da tasiri ga safe na mutanen da kuma zai iya gina lalacewa a kan insulation a kan enclosure da internal conductors, wanda ke buƙata material aging da kuma zai iya gina equipment lifespan. Duk da haka, wannan elevated potential ke haɗa tun daga cables da connected devices zuwa fittattun karamin turuwa, wanda ke gina EMI wanda ke gina false tripping, data errors, ko kuma internal breakdowns—wanda ke dogara nasararsa na power system.
1.3 Electromagnetic Interference (EMI)
A GIS substations, ikkarfin/breaker operations da lightning strikes ke gina transient electromagnetic fields wanda ke gina tasiri a fittattun karamin turuwa tun daga conducted da radiated coupling.
Conducted interference ke faruwa tun daga instrument transformers da ground potential differences. VFTOs ke gina a kan primary zuwa secondary circuits tun daga stray capacitance da inductance a kan transformers. Suna gina shi a kan grounding grid tun daga grounding electrodes, wanda ke gina entire ground potential da kuma gina ground loops wanda ke dogara fittattun karamin turuwa.
Radiated interference ke faruwa idan transient EM fields ke haɗa a kan space, wanda ke gina direct coupling a kan secondary cables da devices. Electric field coupling ke gina tasiri a high-impedance nodes, wanda ke gina signal distortion ko false triggering—wanda ke da alaka da distance, field orientation, da geometry na device. Magnetic field coupling ke gina electromotive forces a kan circuit loops a cikin Faraday’s law; its severity depends on field strength, rate of change, and loop area.
1.4 Tasiri na Mechanical Vibration
Ikkarfin operations ke gina mechanical vibrations saboda contact impact, friction, da electromagnetic forces a lokacin make/break actions. Rapid separation a lokacin opening ko forceful engagement a lokacin closing ke gina shockwaves wanda ke gina vibration a kan structure na GIS. Transmission tun daga linkages da gears ke haɗa vibrations zuwa adjacent fittattun karamin turuwa.
Wannan vibrations ke gina mechanical fasteners suka fito, lalace electrical connections, increase measurement errors, ko kuma—idanci—gina short circuits. Long-term exposure ke buƙata aging a kan mechanical da electronic components, wanda ke gina equipment life da kuma zai iya gina reliability.
2.Manufaruka don Protection na Fittattun Karamin Turuwa
2.1 Optimized GIS Structural Design
Material Selection: Amfani da SF₆ mixtures da dielectric strength mai kyau; zaɓi low-loss, high-conductivity materials (misali, Cu/Al) don shielding; optimize busbar length da capacitance don suppress VFTO amplitude.
Structural Improvements: Smooth conductor da shield geometries don reduce electric field concentration; improve insulator support design don uniform field distribution; implement controlled disconnector operation speeds da add snubber circuits don absorb transient energy.
Vibration Control: Install hydraulic buffers ko springs a operating mechanisms; amfani da rubber dampers a kan GIS da foundations; enhance contact surface precision don minimize impact forces.
2.2 Enhanced Shielding da Grounding
Kasuwanci: Saurar da abubuwa masu mahimmanci (kamar relay, manyan yanayin) a cikin kayan kwallaye (zinc/aluminium) da sauran samfur. Yi amfani da kablun da ake kasuwanta ko kablun da suka kasuwanta biyu da zama ta hanyar daidai; yi amfani da mafi girma da kuma tushen kayan kwallaye a wurare. Don kablun da yake kadan (<10 m), yi amfani da sasar daidai; don kablun masu yawan lokaci, yi amfani da sasar daidai da biyu don in taimaka wajen kusa da tsarin juna.
Sasar: Daite muhimmanci a gaba da tsarin sasar ≤4 Ω. A cikin kasa da yake da yawan karfi, yi amfani da shirye-shirye na sasar da zama ta hanyar daidai. Yi amfani da sasar daidai don circuit masu rubutu da sasar daidai da biyu don systems masu digital/da takam da takaice. Yadda ake gudanar da shirye-shirye (kamar mesh rectangular da electrodes masu cross-junction) don in ba da tafukar mai girma da yawan potential gradients.
2.3 Filtaring da Technologies na Suppression
Filtar: Yan fiye filtar na power-line a input secondary equipment don in kasa noise masu takaice da yake da yawan takam. Yi amfani da algoritmin da ke filtar da data don in tabbatar da ingantaccen bayanin a communication channels.
Surge Protection: Tashar ZnO arresters ya dangane da secondary equipment don in kasa VFTOs da switching surges. Yi amfani da surge protective devices (SPDs) a line signal da communication lines don in kasa transient energy zuwa ground, don in tabbatar da ingantaccen bayanin a transmission masu weak-signal.
2.4 Strengthened Secondary Equipment Hardening
Hardware Protection: Zama muhimmanci a gaba da mounting brackets da steel masu yawan takam da stiffeners. Isolate equipment using rubber mounts ko dual-stage vibration isolators. Secure PCBs with thicker substrates, edge fixings, and damping pads. Pot critical components (e.g., ICs, relays) in encapsulants or elastic holders to prevent loosening. Avoid long, thin traces to reduce fracture risk.
Software Protection: Implement checksums and error-correcting codes (ECC) to detect/correct data corruption. Insert “NOP” (no-operation) instructions in firmware to allow recovery from EMI-induced program jumps, preventing deadlocks and enhancing system resilience.
3.Conclusion
A thorough understanding of how GIS disconnector operations impact secondary equipment reveals that comprehensive mitigation strategies are essential for grid reliability. During design, construction, and operation of power systems, electromagnetic compatibility (EMC) between GIS and secondary systems must be prioritized. By integrating structural optimization, robust shielding/grounding, advanced filtering, and hardware/software hardening, the adverse effects of disconnector-induced transients, EMI, and vibration can be effectively minimized—ensuring safer, more reliable, and resilient power delivery.
